| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for avoiding an excessive temperature rise in a lead part when a high current flows through the lead part. <P>SOLUTION: A lead frame 12 including a header 2 (header part) on which a semiconductor chip 3 (semiconductor element) is mounted and gate leads 4 etc. (lead parts) electrically connected to the semiconductor chip 3 is manufactured by pressing of sheet metal 13 as follows. Specifically, punches 18 having tapered tip portions 18a are pressed against second regions 22 of the sheet metal 13 adjacent to first regions 21 corresponding to the gate leads 4 etc. to deform the metal in the second regions 22 toward the first regions 21, which causes the first regions 21 to bulge to form the gate leads 4 etc. <P>COPYRIGHT: (C)2012,JPO&INPIT |
