| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin very excellent in sufficient extensibility to be applied to a process for film forming/application or the like, and also excellent in balance of heat conductivity, heat resistance or the like. <P>SOLUTION: This epoxy resin obtained by reaction between a bi(s)phenol type epoxy resin and bi(s)phenol has an epoxy equivalent of ≥5,000 and ≤30,000 g/Eq. A bonding group of bi(s)phenol is a direct bond or a divalent linking group selected from -CH<SB POS="POST">2</SB>-, -C(CH<SB POS="POST">3</SB>)<SB POS="POST">2</SB>-, C(CF<SB POS="POST">3</SB>)<SB POS="POST">2</SB>-, -O- and -S-. <P>COPYRIGHT: (C)2012,JPO&INPIT |
