| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device that reduces chipping of an element mounting member, and prevents a thermistor element from being removed when the thermistor element is bonded. <P>SOLUTION: A piezoelectric device comprises: an element mounting member having a substrate section, a first frame section, and a second frame section; a piezoelectric vibration element; a thermistor element 140; a wiring pattern 116 for a pair of two thermistor elements; a lid body for hermetically sealing a first recessed space; an electrode terminal G for external connection provided on the other principal surface of the substrate section of the second frame section; and a third recessed space projecting between two adjacent electrode terminals for external connection at the same side of the second frame section. The wiring pattern for a pair of the two thermistor elements exposed on a bottom surface in a second recessed space is parallel to the third recessed space with a long side of an outer peripheral edge section of the element mounting member, and is provided in a linearly symmetric position to a center line on the bottom surface in the second recessed space. The relation between a diameter L3 after applying a conductive bonding material and a long side length L2 of the wiring pattern for the thermistor elements is 0.65≤L3/L2≤0.85. <P>COPYRIGHT: (C)2012,JPO&INPIT |
