| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting device which can suppress the occurrence of failure caused by adhesion of dust, which is generated when a blank tape discharged from a tape feeder is cut off, to a substrate and a component. <P>SOLUTION: A component mounting device 1 includes a tape feeder 15 for supplying a component 4 to a component taking-out port 15p by pitch-feeding a tape Tp having the component 4 stored therein. This device includes not only a blank tape cutting part 36 for cutting off a blank tape KTp obtained after supplying the component 4 discharged from the tape feeder 15 but also a dust collector 38 for absorbing the dust generated when the blank tape KTp is cut off by the blank tape cutting part 36. <P>COPYRIGHT: (C)2012,JPO&INPIT |
