发明名称 |
PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND LIGHTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element which suppresses fluctuations of light distribution of a light emitting device, which are caused by a difference in thermal expansion coefficients of a substrate and reflection members or the like. <P>SOLUTION: A package for housing a light emitting element includes: a substrate 1 having a mount part 1a of a light emitting element 4 on an upper surface; a frame-like first reflection member 2 attached to the upper surface of the substrate 1 so as to enclose the mount part 1a and having an inner peripheral surface serving as a first light reflection surface 2a; and a frame-like second reflection member 3 which is attached to the upper surface of the substrate 1 so as to enclose the first reflection member 2 having a gap 7 with an outer peripheral surface 2b of the first reflection member 2 and is provided with a second light reflection surface 3b at a position higher than an upper end of the first reflection member 2. This structure reduces stress generated between the reflection members 2, 3 and the substrate 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012114468(A) |
申请公布日期 |
2012.06.14 |
申请号 |
JP20120053568 |
申请日期 |
2012.03.09 |
申请人 |
KYOCERA CORP |
发明人 |
SEKINE FUMIAKI;SAKUMOTO DAISUKE;MORI HIROKI;YANAGISAWA MITSUO;MATSUURA SHINGO |
分类号 |
H01L33/60;H01L23/02;H01L23/08;H01L33/50;H01L33/62 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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