发明名称 METHOD FOR MANUFACTURING MICROCHIP
摘要 <p>[Problem] In conventional methods for manufacturing microchips, ultraviolet light was used in the adhesion of a pair of resin substrates, and that ultraviolet light gave rise to fluorescence in the surface of the resin substrate that was exposed. Therefore, if this microchip is used in fluorescent labeling where a sample is given a fluorescent marker and measurements are made, the problem is the fluorescence arising in the surface of the resin substrate having bad effects on the measurements and detection precision being reduced. [Solution] In a method for manufacturing a microchip having a pair of resin substrates in which mutually opposed surfaces are made to mutually adhere and recessed parts are formed in at least one of the mutually opposed surfaces, the mutually opposed surfaces of the pair of resin substrates are exposed to ultraviolet light, which is light of a wavelength in the ultraviolet region, before being made to adhere. Thereafter, the mutually opposed surfaces of the pair of resin substrates that have been exposed to ultraviolet light are exposed to visible light that substantially includes light with wavelengths in the visible region.</p>
申请公布号 WO2012077383(A1) 申请公布日期 2012.06.14
申请号 WO2011JP68512 申请日期 2011.08.15
申请人 ALPS ELECTRIC CO., LTD.;TANIGUCHI, YOSHINAO;TAGUCHI, YOSHIHIRO;SUGIMURA, HIROYUKI;KIM, YOUNG-JONG 发明人 TANIGUCHI, YOSHINAO;TAGUCHI, YOSHIHIRO;SUGIMURA, HIROYUKI;KIM, YOUNG-JONG
分类号 B01J19/00;B81C3/00;G01N37/00 主分类号 B01J19/00
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