RESIN ENCAPSULATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable resin encapsulating device which can carry out stable resin molding even with a low resin molding pressure.

SOLUTION: The resin encapsulating device 100 which encapsulates works with resin includes: a top platen 10 configured to hold an upper mold 12 which presses the works from a top face side; a moving platen 20 configured to hold an under mold 22 which presses the works from a bottom face side; plungers 23 which deliver the molten resin with pressure when the works are encapsulated with the resin while clumping the works with the upper mold 12 and the under mold 22; a multi transfer unit 24 configured to slide the plungers 23 along pots 21 of the under mold 22; a load cell 30 which detects a resin molding pressure which is applied to the plungers 23 by the multi transfer unit 24; and a precompression means which applies precompression to the load cell 30.

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