| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that it is difficult to sufficiently suppress radiation noise in a switching module equipped with a series connection body of a switching element Swp on a high potential-side and a switching element Swn on a low potential-side. <P>SOLUTION: A semiconductor chip 22p having the switching element Swp and a semiconductor chip 22n having the switching element Swn are buried in a multilayer substrate 20. The semiconductor chip 22p is connected to a snubber circuit SC via a via conductor 24p, a wiring layer 26p and a via conductor 32p. The semiconductor chip 22n is connected to the snubber circuit SC via a via conductor 24n, a wiring layer 26n and a via conductor 32n. The semiconductor chips 22p and 22n are connected to a wiring layer 36 through via conductors 34p and 34n. Thus, a loop circuit constituted of the series connection body of the switching elements Swp and Swn and the snubber circuit SC can be made small. <P>COPYRIGHT: (C)2012,JPO&INPIT |
