| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a hole boring processing device which can reduce waste of a floor plate placed under an object when hole boring processing is performed on the plate-like object and to provide the floor plate. <P>SOLUTION: A bored portion 20 which is cut by a drill 3 that penetrates a substrate 1 upon hole boring processing is freely attached to and detached from a body portion 15. By this, it is possible to continue to use the body portion 15 by exchanging only the bored portion 20, so that it is possible to substantially reduce waste compared to a case where the floor plate is used once and the overall floor plate is discarded as in the prior art. <P>COPYRIGHT: (C)2012,JPO&INPIT |
