摘要 |
<p>The invention relates to a packaged RF transistor (501) with distinct output leads. While a first lead (RF lead) is used for providing an RF output signal, a second lead (Extra lead) is used for applying a supply voltage to the RF transistor. The output (drain) of the RF transistor is connected to these leads via bond wires (505,506). In order to improve the RF decoupling, a transmission line is used for providing the supply voltage, wherein the transmission line may comprise a pair of parallel conductors.</p> |