| 摘要 |
PURPOSE: A light emitting package and a manufacturing method thereof are provided to reduce stress due to thermal expansion coefficient between a first substrate and a second substrate by bonding the first substrate with the second substrate using a bonding insulation pattern layer and a bonding metal pattern layer. CONSTITUTION: A light emitting device(110) includes a first nitride based semiconductor layer(111), an active layer(112), and a second nitride based semiconductor layer(113). A first electrode pad(121) is formed on the first nitride based semiconductor layer. A second electrode pad is formed on the second nitride based semiconductor layer. A fluorescent resin layer(130) is formed on the light extraction surface of the first nitride based semiconductor layer. A substrate(150) includes a via hole(H1,H2) which passes through from the first surface to the second surface. |
