发明名称 |
Heat sink with heat pipes |
摘要 |
A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end. |
申请公布号 |
US8196645(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20070964919 |
申请日期 |
2007.12.27 |
申请人 |
LAI CHI-YUAN;ZHOU ZHI-YONG;LAI CHENG-TIEN;FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
LAI CHI-YUAN;ZHOU ZHI-YONG;LAI CHENG-TIEN |
分类号 |
F28D15/02;F28F7/00;H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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