| 摘要 |
PURPOSE: A circuit board and a semiconductor package module using the same are provided to improve the reliability of solder joint by absorbing stress added to a solder bump. CONSTITUTION: A bonding pad is composed of a landing portion(102) and a supporting portion(104) extended in one side of the landing portion. Solder resist(112) is formed to be spaced from the landing portion. A buffer layer(108) absorbs stress added to a solder bump(300). An insulating layer(110) is formed at a lower portion of the solder resist. Second solder resist(204) is formed around a chip pad(202) of a semiconductor package(200). |
