| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interposer capable of relieving thermal stress onto a solder connection portion and securing connection reliability even in using substrate material with low costs. <P>SOLUTION: An interposer 1 is disposed between an electronic device 6 and a mother board 7 via solder connection portions 4 and 5. Notches are provided at least at opposing two corners of four corners of the interposer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
