| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrostatic chuck excellent in adhesion to a wafer and cooling performance and useful for highly accurate processing, since the temperature of the wafer can be accurately, uniformly, and constantly kept in processes requiring retention of the wafer, such as a plasma etching process, an ion injection process, and a spattering process in particular in manufacturing semiconductor integrated circuits. <P>SOLUTION: An electrostatic chuck comprises a silicone rubber layer made of a cured product of a silicone rubber composition containing (A) organopolysiloxane, (B) a silicone resin copolymer comprising R<SB POS="POST">3</SB>SiO<SB POS="POST">1/2</SB>unit (R is a monovalent hydrocarbon group) and SiO<SB POS="POST">2</SB>unit as main components, having the mole ratio [R<SB POS="POST">3</SB>SiO<SB POS="POST">1/2</SB>/SiO<SB POS="POST">2</SB>] of 0.5-1.5, and containing 1×10<SP POS="POST">-4</SP>-5×10<SP POS="POST">-3</SP>mol/g of a vinyl group, (C) organohydrogenpolysiloxane, and (D) an organic peroxide. The silicone rubber layer is formed on the surface brought into contact with an object to be sucked in the electrostatic chuck having an insulating material layer and an electrode provided in the insulating material layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
