| 摘要 |
The present disclosure discloses a method for fabricating an array substrate comprising: depositing a source/drain metallic film on a first base substrate, and forming a source electrode, a drain electrode and a data line; sequentially depositing a semiconductor layer film, a gate insulating layer film and a gate metallic film on the first base substrate, and forming a semiconductor layer, a gate insulating layer, a gate electrode and a gate line; depositing a gate protection layer film on the first base substrate, and forming a gate protection layer and a through hole, wherein the through hole is formed on the gate protection layer corresponding to the drain electrode to expose a portion of the drain electrode; and depositing a pixel electrode film on the first base substrate, and forming a pixel electrode, wherein the pixel electrode is connected to the drain electrode via the through hole.
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