| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component capable of reducing steps for cutting a part of a ceramic laminate to reduce a manufacturing cost, and shortening a manufacturing time until dicing the ceramic laminate into pieces for laminated chips or strip-like laminates, and to provide an electronic component manufacturing device. <P>SOLUTION: The method for manufacturing an electronic component comprises the steps of: forming an aggregate 22 having a plurality of strip-like laminates 21 connecting laminated chips cut from a ceramic laminate 2 laminated with a plurality of ceramic layers and a plurality of internal electrode layers in one direction and disposed at intervals; applying a conductive paste 23 so as to cross the adjacent strip-like laminates 21 of the aggregate 22; extending intervals of the adjacent strip-like laminates 21 so that the conductive paste 23 is independently applied on each strip-like laminate 21 before drying the conductive paste 23; drying the conductive paste 23; and forming external electrodes 24 on the strip-like laminates 21. <P>COPYRIGHT: (C)2012,JPO&INPIT |
