发明名称 |
METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING |
摘要 |
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
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申请公布号 |
US2012137514(A1) |
申请公布日期 |
2012.06.07 |
申请号 |
US201113311436 |
申请日期 |
2011.12.05 |
申请人 |
HOANG DINHPHUOC V.;NOLL THOMAS E.;AGARWAL ANIL K.;WARREN ROBERT W.;READ MATTHEW S.;LOBIANCO ANTHONY;SKYWORKS SOLUTION, INC. |
发明人 |
HOANG DINHPHUOC V.;NOLL THOMAS E.;AGARWAL ANIL K.;WARREN ROBERT W.;READ MATTHEW S.;LOBIANCO ANTHONY |
分类号 |
H05K3/36;H01L21/56;H01L23/31;H01L23/552 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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