| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method for the same. <P>SOLUTION: A printed circuit board according to an embodiment of the present invention includes a first circuit pattern provided for a core substrate, an insulation layer stacked on the core substrate so as to cover the first circuit pattern and having uniform nanometer-level surface roughness, a second circuit pattern provided for the insulation layer, and a via pattern formed through the insulation layer for electrically connecting the first circuit pattern and the second circuit pattern to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
