| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce stress actually applied to a joint between a solder ball for exchanging electrical signals and a connection electrode without increasing the size of an electronic component in relation to an electronic component mounting apparatus and its manufacturing method. <P>SOLUTION: The electronic component mounting apparatus includes an electronic component in which solder balls are prepared in a matrix shape on an adhesive surface side while at least some of the solder balls at its outermost circumferential part are replaced by metal pins higher than the solder balls in height and a circuit substrate in which connection electrodes are prepared on a mounting surface side at positions facing the solder balls and concave portions are prepared at positions facing the metal pins, the concave portions into which low-melting solder having a melting point lower than that of the solder balls is filled, wherein the solder balls and the connection electrodes form a joint while the metal pins are joined with the low-melting solder in the concave portions. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
