| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition usable as a sealing material, an adhesive and a coating agent, and also improved in residual tack though the modulus of the cured product is low. <P>SOLUTION: The problem is solved by using a curable composition containing (A) 100 pts.wt. of a reactive silicon-containing organic polymer with a number-average molecular weight of 2,000-8,000 and (B) 1-600 pts.wt. of a plasticizer, where the number of silicon groups per one molecule of the component (A) of the reactive silicon-containing organic polymer is preferably 1.3 or more. <P>COPYRIGHT: (C)2012,JPO&INPIT |
