| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of improving a yield by secure bump connection between a solid state imaging device and metal wiring. <P>SOLUTION: The imaging apparatus includes: a pixel array having a plurality of pixels disposed in a two-dimensional matrix shape; pads 51 provided corresponding to the pixel columns of the pixel array, for outputting pixel signals in the pixel columns; sensor chips 5 arrayed in the row direction of the pixel array, and having a signal output terminal group in which the plurality of pads 51 are arrayed in the column direction of the pixel array; and a glass substrate 6 having laminated wiring 32, composed of a laminated plurality of wiring layers 71, provided for each signal output terminal group. The laminated wiring 32 includes a first terminal portion 61 extending in the column direction of the pixel array, with each wiring layer 71 exposed at a position opposite to each pad 51 in the signal output terminal group. The pad 51 is connected to the first terminal portion 61 via a bump 9. <P>COPYRIGHT: (C)2012,JPO&INPIT |
