发明名称 |
MULTI-SENSOR INTEGRATED CIRCUIT DEVICE |
摘要 |
A multiple sensor-types integrated circuit device includes a semiconductor die including a first sensor type and a second sensor type formed thereon, an electrically insulating package enclosing the semiconductor die and a plurality of electrically conductive leads coupled to the semiconductor die and extending from the package. By way of example and not limitation, a multiple sensor-types integrated circuit die includes a semiconductor substrate of a first polarity, a plurality of regions of the first polarity formed in the substrate, where the plurality of regions are relatively more heavily doped than the substrate, multiple wells formed in the substrate, and a covering layer formed over the substrate. |
申请公布号 |
WO2012012569(A3) |
申请公布日期 |
2012.05.31 |
申请号 |
WO2011US44728 |
申请日期 |
2011.07.20 |
申请人 |
MAXIM INTEGRATED PRODUCTS, INC;KESTELLI, NEVZAT AKIN;SKURNIK, DAVID |
发明人 |
KESTELLI, NEVZAT AKIN;SKURNIK, DAVID |
分类号 |
H01L31/00 |
主分类号 |
H01L31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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