发明名称 CURABLE COMPOSITION
摘要 The objective of the present invention is to provide a curable composition having high hardness, which can be used as an adhesive or a coating agent. The objective can be achieved by a curable composition which contains (A) 100 parts by weight of a reactive silicon group-containing organic polymer that has a number average molecular weight of 2,000-6,000 and contains 1.3-5 reactive silicon groups in each molecule and (C) 0-40 parts by weight of a plasticizer. The curable composition is suitable for an adhesive for floors or an adhesive for tiling, said adhesive being required to have high hardness.
申请公布号 WO2012070476(A1) 申请公布日期 2012.05.31
申请号 WO2011JP76618 申请日期 2011.11.18
申请人 KANEKA CORPORATION;MIYAFUJI, KIYOSHI;YANO, AYAKO 发明人 MIYAFUJI, KIYOSHI;YANO, AYAKO
分类号 C08L101/10;C09D201/10;C09J201/10 主分类号 C08L101/10
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