INTERCONNECT STRUCTURE AND METHOD FOR PRODUCING SAME

摘要

A three-dimensional interconnect structure for microelectronic devices and a method for producing such an interconnect structure. The method comprises a step wherein a backbone structure (100) is manufactured using an additive layer-wise manufacturing process (310). The backbone structure (100) comprises a three-dimensional cladding skeleton (104) and a support structure (101). The cladding skeleton comprises layered freeform skeleton parts (105) that will form the electric interconnections between the electric contacts of the interconnect structure after a conductive material (202) is applied on the backbone structure (100). The support structure (101) supports the layered freeform skeleton parts (105). Parts (306) of the support structure (101) may be removed to isolate and/or expose the electric interconnections (205). The cladding skeleton can be embedded by an insulating material (303) for providing a further support.