发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.
申请公布号 US2012132942(A1) 申请公布日期 2012.05.31
申请号 US201113186483 申请日期 2011.07.20
申请人 WANG KAI-LUN;LIN HOU-TE;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 WANG KAI-LUN;LIN HOU-TE
分类号 H01L33/50 主分类号 H01L33/50
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