| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad capable of improving a polishing rate and flatness of a polishing object. <P>SOLUTION: The polishing pad 10 is equipped with a resin sheet 2 which is formed by wet solidification method using polyurethane resin of soft resin and polysulfone resin, the polysulfone resin being soluble relative to a solvent in which polyurethane resin is soluble and being harder than polyurethane resin. The resin sheet 2 includes a skin layer 2a, foam resin part 2b in which micro pores 4 are formed, and a spherical resin 3 which is dispersedly formed in the foam resin part 2b. The surface of the skin layer 2a forms a polishing face P. The spherical resin 3 has an average diameter larger than that of the micro pores 4 formed in the foam resin 2b and is formed mainly of polysulfone resin. The spherical resin 3 has higher density as compared with the foam resin part 2b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
