| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a photoelectric composite wiring board which can realize a composite of an optical waveguide and an electric circuit with high adhesion, thereby enabling a manufacture of the photoelectric composite wiring board with no loss in the optical waveguide or no coupling loss between a light reception element and an optical circuit. <P>SOLUTION: A manufacturing method for a photoelectric composite wiring board comprises: a core formation step of forming a core 13 on a first clad layer 12 formed on a substrate 11; a second clad material layer formation step of forming a second clad material layer 17 including an uncured resin composition, on a metal base 16 having at least one surface thereof roughened; a clad layer lamination step of laminating a second clad layer 12 so that the second clad material layer 17 on which the metal base 16 is laminated is embedded in the core 13 formed on the first clad layer 12; a second clad layer formation step of forming a second clad layer 18 by curing the uncured resin composition of the second clad material layer 17; and an electric circuit formation step of forming an electric circuit on the metal base 16. The refractive index of the resin composition of the second clad layer 12 is lower than that of the core 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
