| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device of cooling a semiconductor package which has a high cooling effect. <P>SOLUTION: A device of cooling a semiconductor package has: a circulation device 100 for cooling medium 300; and a cooler 200 in which the cooling medium 300 is circulated by the circulation device 100. The cooler 200 has a plate part 240 contacting with a semiconductor device 420 via a heat transfer medium 500. The plate part 240 is formed in a concaved shape substantially matched to the warpage of the semiconductor device 420, and has a thickness deformable by variation in an inner pressure in the cooler 200. By varying the inner pressure in the cooler 200, the plate part 240 is made to follow the warpage of the semiconductor device 420. <P>COPYRIGHT: (C)2012,JPO&INPIT |
