BONDING COMPOSITION FOR A ROTARY TARGET FOR SPUTTERING AND BONDING METHOD OF A ROTARY TARGET USING SAME

摘要

The present invention relates to a bonding composition for a rotary target for a sputtering and bonding method of a rotary target using the same. According to the present invention, the bonding composition for a rotary target for sputtering bonds a cylindrical target to an outer peripheral surface of a cylindrical backing tube of the rotary target for sputtering, wherein the rotary target is rotatably installed in a chamber for sputtering to apply high voltage while being rotated by a driving motor, wherein the bonding composition for sputtering, for bonding the target to the outer peripheral surface of the backing tube comprises a mixture of 50 to 54 wt% of Bismuth and 46 to 50 wt% of tin (Sn). In addition, provided is a method for bonding a rotary target for sputtering, using the bonding composition for a rotary target. According to the present invention, production cost for a rotary target for sputtering is significantly reduced.