发明名称 CURABLE RESIN COMPOSITION AND CURED ARTICLE
摘要 <p>The curable resin composition according to the present invention contains ladder silsesquioxane (A) and straight-chain polysiloxane (B) having a molecular weight of 100 to 9000, (A) and (B) being able to react with each other to form carbon-silica bonds by hydrosilylation, and a hydrosilylation catalyst (C). The curable resin composition may further contain an isocyanuric acid compound (D) that can form carbon-silica bonds by hydrosilylation by reacting with the ladder silsesquioxane (A) and/or straight-chain polysiloxane (B). Using the curable resin composition of the present invention, it is possible to obtain cured articles having high-temperature heat resistance, flexibility, transparency, resistance to heat-induced yellowing, resistance to light-induced yellowing, and the like.</p>
申请公布号 WO2012070525(A1) 申请公布日期 2012.05.31
申请号 WO2011JP76792 申请日期 2011.11.21
申请人 DAICEL CORPORATION;KAMURO, SHIGEAKI;INOUE, KEIZO;FUBETSU, HIROFUMI 发明人 KAMURO, SHIGEAKI;INOUE, KEIZO;FUBETSU, HIROFUMI
分类号 C08L83/07;C08L83/05;H01L33/56 主分类号 C08L83/07
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