Sheet cutting device and cutting method

摘要

A cutting device that, after a sheet is stuck on a wafer on a sticking table, cuts the sheet along the outer edge of the wafer. The cutting device includes a robot body disposed besides the sticking table and a cutter blade supported by a tool holding chuck positioned at the front end of the robot body. The cutter blade is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet in a state that the posture thereof is adjusted along a preset movement track.