| 摘要 |
The present invention relates to an epoxy resin composition, in particular, to an epoxy resin composition suitable for use as an encapsulation agent for electrical parts such as drive- ICs mounted on a circuit board. The epoxy composition is a liquid phase at room temperature and includes 100 parts by weight of an epoxy resin having 2 or more glycidyl groups in the molecure, 10-50 parts by weight of a reactive diluent having one or more glycidyl groups in the molecure, 50-200 parts by weight of an anhydrous curing agent which is a liquid phase at room temperature with respect to 100 parts by weight of the epoxy resin and the reactive diluent, and 1-20 parts by weight of a latent curing accelerator with respect to 100 parts by weight of the epoxy resin, the reactive diluent, and the anhydrous curing agent, and whose viscosity at 25 °C is 250-500cps, gelation time at 150°C is below 120 seconds.
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