| 发明名称 |
WAFER LEVEL CHIP PACKAGE AND A METHOD OF FABRICATING THEREOF |
| 摘要 |
Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.
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| 申请公布号 |
US2012126407(A1) |
申请公布日期 |
2012.05.24 |
| 申请号 |
US201213356752 |
申请日期 |
2012.01.24 |
| 申请人 |
KANG TECK-GYU;HABA BELGACEM;GAO GUILIAN;TESSERA, INC. |
发明人 |
KANG TECK-GYU;HABA BELGACEM;GAO GUILIAN |
| 分类号 |
H01L23/498;H01L21/762 |
主分类号 |
H01L23/498 |
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