| 摘要 |
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to prevent moisture and particles from penetrating through a package by electrodepositing encapsulants around a bump between a semiconductor die and a substrate. CONSTITUTION: A plurality of bumps are formed on an active surface of a semiconductor die(58). A plurality of conductive traces(54) with an interconnection site narrower than the bump is formed on a substrate(52). A masking layer is formed in an area separated from the interconnection site on the substrate. Encapsulants are electrodeposited around the bump between the semiconductor die and the substrate. |
