POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
摘要
Polishing pads for polishing semiconductor substrates using eddy current end- point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
申请公布号
WO2012044683(A3)
申请公布日期
2012.05.24
申请号
WO2011US53678
申请日期
2011.09.28
申请人
NEXPLANAR CORPORATION;WILLIAM, ALLISON, C.;SCOTT, DIANE;HUANG, PING;FRENTZEL, RICHARD;SIMPSON, ALEXANDER, WILLIAM
发明人
WILLIAM, ALLISON, C.;SCOTT, DIANE;HUANG, PING;FRENTZEL, RICHARD;SIMPSON, ALEXANDER, WILLIAM
