| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus having a structure which prevents components having low heat-resistant temperatures from being thermally damaged by heat generated in a chip even when the chip is formed by a wideband gap semiconductor. <P>SOLUTION: A copper substrate (22), used for transmitting heat of a chip (21) to a heat sink (23) for radiating the heat of the chip (21) formed by a SiC semiconductor, is bonded and fixed to printed substrates (25, 25) through a heat insulation member (24) formed by a heat-resistant adhesive. Heat shield panels (26) for suppressing heat radiation from the chip (21) and the like are provided between the copper substrate (22) and the printed substrates (25, 25). <P>COPYRIGHT: (C)2012,JPO&INPIT |
