发明名称 DECOUPLING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a decoupling device which is low in manufacturing cost and characteristic variations due to temperature changes. <P>SOLUTION: A decoupling device 100 comprises: a laminate 110 formed by alternately and repeatedly laminating a plurality of first internal conductor layers 111 and a plurality of second internal conductor layers 112 or a plurality of third internal conductor layers 113; a first external electrode 121 formed on outer surface of the laminate 110 and connected to the first internal conductor layers 111; a second external electrode 122 formed on the outer surface of the laminate 110 and connected to the third internal conductor layers 113; and a resistive electrode 130 formed on the outer surface of the laminate 110, connecting the second internal conductor layers 112 and the third internal conductor layers 113, and having a predetermined resistance value R11. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012099772(A) 申请公布日期 2012.05.24
申请号 JP20100248661 申请日期 2010.11.05
申请人 TAIYO YUDEN CO LTD 发明人 SAITO KENJI
分类号 H01G4/40;H01G4/232;H01G4/30 主分类号 H01G4/40
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