| 摘要 |
PURPOSE: A manufacturing method of a light emitting device package is provided to etch a part of fluorescent resin using a photosensitive material after performing a single fluorescent resin coating process on a plurality of light emitting device chips, thereby reducing time required for fluorescent resin formation. CONSTITUTION: An adhesion material(120) is coated on each part of a plurality of chip mounting regions arranged on a substrate(110). A plurality of light emitting device chips(131,132,133) is mounted on the plurality of chip mounting regions. A fluorescent resin is coated on the substrate in order to cover the light emitting device chips. A photosensitive material is coated on the coated fluorescent resin. A part of the fluorescent resin is exposed by patterning the photosensitive material. The exposed fluorescent resin is etched.
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