MANUFACTURING METHOD OF LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device package manufacturing method is provided to minimize impact applied on a device during a package separation process, thereby improving productivity. CONSTITUTION: A pair of lead frames is respectively connected to a base frame(101). A light emitting device(103) is arranged on the pair of lead frames. A light transmissive resin part(104) is formed in order to cover a part of the light emitting device and the lead frames. The base frame is arranged on molds(105,106). The lead frame and the base frame are separated by punching a connection part of the lead frame and the base frame.