发明名称 |
ELECTROCHEMICAL DEVICE AND PACKAGING STRUCTURE THEREOF |
摘要 |
<p>Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.</p> |
申请公布号 |
KR101146295(B1) |
申请公布日期 |
2012.05.21 |
申请号 |
KR20107023433 |
申请日期 |
2009.05.07 |
申请人 |
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发明人 |
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分类号 |
H01G9/08;H01G11/12;H01G11/18;H01G11/74;H01G11/76;H01G11/82;H01M2/06 |
主分类号 |
H01G9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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