| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal-ceramic substrate in which mechanical, thermal and electrical characteristics are improved. <P>SOLUTION: The metal-ceramic substrate 1 especially for an electric circuit or a module comprises at least one first outer metal layer 4 forming one first surface side of the metal-ceramic substrate 1, and at least one second outer metal layer 5 forming one second surface side of the metal-ceramic substrate 1. The outer metal layers are bonded, respectively, to the surface side of a planar substrate body by two-dimensional bonding. In order to improve mechanical, thermal and electrical characteristics, at least one intermediate layer 3 is also provided and bonded to an inner metal layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
