| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify the structure of a substrate bonding apparatus and improve the accuracy of substrate positioning. <P>SOLUTION: There is provided a stage device, which includes a movable first stage, a second stage which is disposed on the first stage, movable relative to the first stage, and supports a substrate; and an induction heating part which is disposed on the first stage and performs induction heating on the substrate. The movable range of the first stage relative to a body part may be larger than the movable range of the second stage relative to the first stage. The second stage may have a stage body driven by the first stage and a heating body which is held while forming an air gap with the stage body, is heated through electromagnetic induction of the induction heating part, and transmits the heat to the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
