| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce heat resistance of a metal stage, improve heat radiation, and suppress the temperature increase of a semiconductor device. <P>SOLUTION: An electronic apparatus includes a metal base 21, a wiring board 20 which is provided above the metal base 21, has an opening 20A for a metal stage, and includes a wiring layer 23, the metal stage 27 provided at the opening 20A for the metal stage and serving as a ground line, and a semiconductor device 4 provided above the metal stage 27. The metal stage 27 is formed so that an end surface on the metal base 21 side becomes larger than an end surface on the semiconductor device 4 side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
