| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problems in the conventional organic multilayer substrate such that connection reliability is insufficient because electric and mechanical connections between an embedded laminate electronic component and a wiring conductor of the substrate are made only at the side face electrode portion of the external electrode of the electronic component, and the response of an electronic apparatus using the substrate is deteriorated because of a narrow connection face between the electronic component and the wiring conductor and a long distance from the connection face to the internal electrode of the electronic component by which parasitic resistance and inductance components are produced therein. <P>SOLUTION: The electric and mechanical connections between the electronic component and the substrate wiring conductor are also made at an end face electrode portion, in addition to the side face electrode portion of the external electrode of the electronic component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
