| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor optical element having excellent reliability by embedding using a BCB resin. <P>SOLUTION: A semiconductor optical element DV comprises: a semiconductor region 63 including a ridge structure 63a and trenches 63b and 63c, the trenches 63b and 63c being defined by the ridge structure 63a and projecting portions 63s; a protective layer 65 having an opening 34c on an upper face 63p of the ridge structure; a non-photosensitive BCB resin body 67 having an opening 67c on the upper face 63p of the ridge structure, and provided on the projecting portions 63s and filled in the trenches 63b and 63c to embed the ridge structure 63a; and an electrode 69 being in contact with the ridge structure 63a, wherein a thickness D2 of the non-photosensitive BCB resin body 67 is less than 2.0 μm on the projecting portions 63s, and an end face EF of the element extends from an edge of a back face 61b of a support base to an edge of an upper face 67d of the non-photosensitive BCB resin body 67, and the end face EF of the element includes a fracture face 67cv, a cleavage face 61cv and a cleavage face 63cv. <P>COPYRIGHT: (C)2012,JPO&INPIT |
