| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device by which void of a first substrate and a second substrate that are joined is hardly generated. <P>SOLUTION: A resin layer 130 is introduced between a first substrate 110 and a second substrate 120, a low temperature solder bump 121 is melted at specific low temperature, and temporary joint is individually performed on the low temperature solder bump 121 and a high temperature solder bump 111 that is not melted yet. After that the resin layer 130 is hardened, and the low temperature solder bump 121 and the high temperature solder bump 111 on which the temporary joint is performed are melted at specific high temperature and actually jointed individually. <P>COPYRIGHT: (C)2012,JPO&INPIT |
