| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for dividing a multilayer ceramic capacitor board, which efficiently divides the board into individual chip capacitors. <P>SOLUTION: This dividing method includes: an ID mark setting step which sets an ID mark 100 on a multilayer ceramic capacitor board 10; an electrode exposing step which forms a pair of inclined grooves so as to be adjacent to a pair of sides facing the multilayer ceramic capacitor board, and exposes an electrode 121, by using a first processing device; a cutting position information preparing step which takes an image of the electrode exposed by the electrode exposing step with an imaging means for taking the image of the electrode, detects a cut coordinate value of intermediate positions between each electrode, and prepares cutting position information of the multilayer ceramic capacitor board in which the ID mark has been set; and a cutting step which acquires the cutting position information by reading the ID mark set in the multilayer ceramic capacitor board for which the cutting position information preparing step has been performed, and cuts the multilayer ceramic capacitor board based on the cutting position information, by using a second processing device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
