| 摘要 |
A heat sink (3) made of a material excellent in thermal conductivity and is mounted on a stem (1); a sub-mount substrate (4) made of a material excellent in insulation property and is mounted on the heat sink (3); a first lead frame (5) made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array (7), mounted on the sub-mount substrate (4), having the semiconductor laser array (7) mounted thereon, and composing a power feeding path of the semiconductor laser array (7); a second lead frame (6) made of a material excellent in electric conductivity and thermal conductivity, arranged on the sub-mount substrate (4) side by side with the first lead frame (5), and composing the power feeding path of the semiconductor laser array (7); and a wire (8) for electrically bonding the semiconductor laser array (7) and the second lead frame (6) are included.
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