HEATING DEVICE

摘要

A heating device (1A) is provided with: a susceptor section (9A) having a heating surface (9a) for heating a semiconductor (W); and a ring-shaped section (6A) disposed on the outside of the heating surface (9a). The ring-shaped section (6A) is formed from a ceramic material containing, as the main components, magnesium, aluminum, oxygen and nitrogen, wherein the ceramic material has, as the main phase, a magnesium-aluminum oxynitride phase having an XRD peak at least at 2?=47 to 50° when using CuKa radiation.